Double core slicing is used to measure the internal stresses in panels that are the causes of bowing, and is one way of following the process changes that lead to flat results. It allows our technicians to see these internal stresses, and gauge what effects they are having on the overall problem.

We also use other techniques like rapid linear-hygroexpansion evaluation, density profiling, Ichikawa diagrams, and other novel evaluation techniques to understand which parameter controls the board shape.

After the indepth measuring process, we have several mathmatical tools which produce graphs that will highlight the problem areas. It is then up to experience to correctly identify the cause and solution model.
From this point, we will suggest a solution and monitor the outcomes until the problem is resolved.

Using these techniques we have solved many problems, some of which are listed on the Problems Resolved page...